حول PCBMASTER
While launched as an independent brand in 2022, PCBMASTER is built on a powerhouse foundation—our founding team and core R&D engineers bring over 15 years of deep industry expertise. This unique blend of modern digital agility and veteran technical mastery enables us to conquer the most challenging engineering frontiers. From 64-layer advanced boards and Any-Layer HDI to complex Rigid-Flex architectures, our robust Design for Manufacturability (DFM) auditing and self-operated facilities ensure your innovations transition flawlessly from concept to creation.
منتجاتنا
عرض جميع المنتجات ← →
Flex PCB, Flexible Printed Circuit (FPC), Rigid-Flex PCB, Printed Circuit Board Manufacturing, PCB Assembly (PCBA).
الموديل: Various custom model names based on layers/materials/processes (e.g., 2L FR-4, Rigid-Flex, Rogers HF PCB, Ceramic PCB, etc.)
المعلمات: 1. Basic Structure & Dimensions
Layer count: ≤64 layers
Stack-up: Any-layer (12L)
Max finished dimension: 620*1092mm
Max finished board thickness: 4.2mm
2. Impedance Tolerance
Differential impedance (>50ohm): ±7%
Single-ended 50ohm impedance: ±6%
3. Layer Registration Tolerance
Boards ≤12 layers: ≥3mil
Boards over 12 layers: ≥4mil
N+N stack-up structure: ≥4mil
4. Pattern Accuracy
Board dimension over 500mm: ±5mil
5. Drilling & Copper Filling Capacity
Laser blind hole spec: 65/165μm
Max dimple of plated filled hole: 10μm
Plating aspect ratio of through hole: 16:1
6. Back-drill Process Parameters
Min back-drill diameter: 0.35mm
Min stub length: 5mil
Min distance from back-drill to copper: 5mil
7. Supported Special Processes
Available processes: POFV, N+N structure, hybrid lamination, deep blind microvia, metallized half hole
For more product parameters, please visit the official PCBMASTER website or consult the PCBMASTER customer service team.
معرض الشركة
الشهادات والجوائز
قصص النجاح
Global wearable device developers, smart medical instrument manufacturers, automotive electronics Tier-1 suppliers, and industrial automation control system integrators.
Ensure long-term stable operation of end products. The steady first-pass production yield reaches 99.6%, and the on-time delivery rate stands at 99.5%.
We are capable of complex special processes including back drilling, via filling, any-layer HDI and IC substrate fabrication. Equipped with large self-owned factories and one-stop component sourcing service, our solutions fit projects requiring complex structures and high reliability standards.
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