SEO Title: GD01 1.27 mm Pitch 8 Gbps Floating Board-to-Board Connector
Meta Description: GD01 1.27 mm pitch floating board-to-board connector delivers 8 Gbps data, 1.7 A per pin, multi-axis floating compensation and 500 mating cycles for SMT use.
1.27 mm Pitch 8 Gbps High-Speed Floating Board-to-Board Connector
GD01 high-speed floating board-to-board connector, 1.27 mm pitch, SMT mounting
Product Summary
The GD01 is a 1.27 mm pitch high-speed floating board-to-board connector built for compact, high-density PCB layouts where two boards must mate reliably despite assembly tolerance. It combines 8 Gbps data transmission with a current rating of 1.7 A per pin, so signal and power can be routed through a single interface. A multi-axis floating structure compensates for misalignment during mating, while LCP insulation and phosphor bronze contacts with gold-plated mating surfaces support contact resistance of 25 mΩ and insulation resistance of 10000 MΩ. Surface-mount termination keeps the connector compatible with automated reflow assembly at 260±5°C for 5–15 s.
Key Features
1.27 mm PitchSupports a high-density contact layout on space-constrained boards.
8 Gbps Data Transmission8 Gbit/s transfer speed for high-speed board-level signal links.
The GD01 is supplied in the 1.27 mm pitch configuration with SMT mounting. Beyond this standard build, Greenconn provides custom connector solutions tailored to specific electrical, mechanical, environmental and application requirements, backed by in-house design, tooling, precision stamping, plating, injection molding and automated assembly. Share your board stack-up, required pin count and signal requirements with the engineering team to confirm a suitable configuration.
Materials and Structure
The insulator is moulded from LCP, a high-temperature material compatible with reflow processing. Contacts are produced from phosphor bronze for mechanical resilience and spring force, finished with a nickel underlayer, a tinned surface and gold-plated contacts. A floating structure provides multi-axis compensation between the mating boards, and SMT termination keeps the connector suited to automated assembly at 260±5°C for 5–15 s.
Applications
The GD01 is designed for board-to-board interconnection in industrial, automotive, robot, commercial, medical and telecommunication equipment, including:
Robotics and industrial automation – control boards and motion modules where floating compensation absorbs assembly tolerance.
Automotive electronics – in-vehicle control and sensor boards using high-speed board-level links.
Medical equipment – monitoring and diagnostic devices; Greenconn maintains a quality management system certified to ISO 13485.
Telecommunication and network equipment – board-level interconnect in base stations and data communication hardware.
Commercial and consumer electronics – compact high-density board stacks.
Customization
Greenconn supports application-specific interconnect designs covering connector development, prototyping, validation and mass production, with 69 engineers and integrated capabilities in precision stamping, plating, injection molding, automated assembly and testing. For GD01 projects, provide your electrical, mechanical and environmental requirements so the team can evaluate a custom build.
FAQ
What is the pitch of the GD01 connector?
The GD01 uses a 1.27 mm pitch contact layout.
What data transmission speed does it support?
The connector supports 8 Gbps data transmission, equivalent to a transfer speed of 8 Gbit/s.
What is the current rating per pin?
The current rating is 1.7 A per pin.
How many mating cycles is it rated for?
The GD01 is rated for 500 mating cycles, with an insertion and extraction force of 0.5 N per pin max.
What operating temperature and mechanical loads can it withstand?
The operating temperature range is −55°C to 125°C, with sinusoidal vibration of 10~2000 Hz at 20g and half-sine shock of 50g / 11ms.
What materials and plating are used?
The insulator is LCP and the contacts are phosphor bronze, plated with a nickel underlayer, a tinned surface and gold-plated contacts.
How is the connector mounted and soldered?
The GD01 uses SMT mounting and is rated for soldering at 260±5°C for 5~15 s.
Can a customized configuration be requested?
Yes. Greenconn provides custom interconnect solutions tailored to specific electrical, mechanical, environmental and application requirements; contact the engineering team with your project details.
