DZY Series Precision Diamond Dicing Blade

Product Summary

The DZY Series is a versatile diamond dicing blade designed for high-precision wafer cutting in semiconductor manufacturing. With a thickness range of 8μm to 50μm and cutting accuracy of ±0.002mm, it delivers clean, chipping-free cuts for brittle materials. Suitable for spindle speeds up to 60000rpm, this blade ensures efficient dicing with minimal kerf loss.

Key Selling Points

• Ultra-Precise Cutting: ±0.002mm accuracy reduces material waste and improves die strength.
• Wide Thickness Range: 8μm to 50μm accommodates various wafer and substrate thicknesses.
• High-Speed Capability: Operates at 30000-60000rpm for increased throughput.
• Versatile Bond Matrix: Resin or metal bond options available for different material hardness.

Technical Specifications

Models and Options

The DZY Series is available in multiple outer diameters and bore sizes to match common dicing saws. Standard diameters include 58mm, 76mm, and 102mm. Custom dimensions available upon request.

Materials and Structure

Constructed with a high-strength steel core and a diamond-impregnated cutting edge. The bond matrix can be selected as resin (for softer materials) or metal (for harder substrates). The blade is hubless and flanged design ensures compatibility with most automatic dicing saws.

Applications

• Semiconductor wafer dicing
• Precision electronic component cutting
• Optical ceramic slicing
• LED substrate dicing

Customization

Custom blade thickness, outer diameter, bore size, and bond type are available. Minimum order quantity for standard models: 100 pieces; for customized models: 500 pieces. Small-batch trial orders (<500 pcs) accepted with flexible MOQ adjustment.

FAQ

1. What is the typical lifespan of a DZY Series blade?

Blade life depends on cutting parameters and material. Under standard conditions, the blade can achieve >100,000 cuts per blade.

2. Can this blade be used for copper lead frames?

Yes, the DZY Series with metal bond is suitable for copper lead frames and other ductile metals.

3. What bond type do you recommend for silicon wafers?

Resin bond is recommended for silicon wafers to minimize chipping.

4. Do you offer blade dressing services?

Yes, we provide dressing tools and services to maintain blade performance.

5. How are the blades packaged?

Each blade is individually packaged in a vacuum-sealed anti-static bag with foam cushioning.

6. What is the delivery time for standard orders?

Standard orders (100 pcs) are shipped within 7-10 working days after order confirmation.

Inquiry Information

For pricing, availability, or technical support, please contact:
Email: shenxiangfei@ntwintime.com
Tel: +86 13851530812
Whatsapp: +8618888053207