HDI

Name: "HDI"
Rating: 5 (644 reviews)

SKU: 1605025844

الطراز: M7

SHENZHEN JERICO MULTILAYER PCB CO., LTD

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Product Specification

Type	3‑step HDI	Model	M7
Params	Layer:32‑Layer, 3‑step HDI Stack‑up:4+24+4 Base Material: High‑Tg FR‑4, Tg≥180℃ Finished Board Thickness:3.20mm ±0.10mm Outer copper thickness:2oz(70μm) Inner copper thickness:2oz(70μm) Min BGA pitch: 0.4 mm Controlled impedance:Differential 100Ω±8%, Single‑ended 50Ω±10% for PCIe high‑speed signal Solder mask: Green Silkscreen:White Surface treatment: ENIG 1U" Gold finger: Hard gold plating 30U" Step depth: 0.8 mm PTH & Laser blind vias Electrical Test:100% Flying‑probe test X‑ray inspection for BGA microvias Compliance:IPC‑A‑6012 Class3, UL94 V‑0 Panel: Single-piece delivery	Material	TU933
Applicable Industry	HPC；Telecommunications industry；Automotive ; Medical electronics;Military

Feature

32‑Layer advanced HDI PCB with 4+24+4 stack‑up, supports fan‑out for ultra‑fine pitch 0.4mm BGA for enterprise‑grade high‑speed routers. Adopt High‑Tg FR‑4 material Tg≥180℃, featuring low Z‑axis expansion, excellent CAF resistance, preventing warpage & delamination after multiple lamination cycles. Custom stepped‑plate with 30U’’ hard‑gold plated gold finger, great wear resistance for repeated plug‑in with backplane connector. Tight controlled impedance (Diff 100Ω ±8%, Single‑ended 50Ω ±10%) to guarantee PCIe high‑speed signal integrity. Stacked microvias with resin‑filled planarization & via‑in‑pad for BGA area. Manufactured per IPC‑A‑6012 Class‑3 reliability standard. 100% flying‑probe electrical test plus X‑ray inspection for microvia quality, ideal for enterprise networking & high‑performance computing hardware.