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The IC610 is an industrial core module (System on Module) built as an embedded minimum system around the ST STM32MP25X processor. It combines a Cortex-A35 application core and a Cortex-M33 real-time core in an MPU+MCU+NPU heterogeneous multi-core architecture, so a single module can handle Linux-class computing and deterministic real-time tasks at the same time. This 1GB DDR4 + 8GB eMMC configuration gives hardware teams a ready compute platform that runs Linux 6.1 and is rated for -40°C to +85°C operation.
Measuring only 37mm × 39mm × 2.8mm, the IC610 uses LCC/LGA metal contacts and a multi-device interface, allowing industrial HMI, charging pile controllers, IoT gateways, portable medical equipment and intelligent control systems to be built without designing a complete processor board from scratch.
MPU+MCU+NPU cores work together — the ST STM32MP25X Cortex-A35 handles Linux applications while the Cortex-M33 core covers real-time control.
Integrated 1GB DDR4 memory and 8GB eMMC storage reduce external memory design work and simplify the carrier board.
Rated for -40°C to +85°C, supporting equipment deployed in uncontrolled industrial environments.
Runs the Linux 6.1 operating system, giving development teams a mature software stack and toolchain.
The small module format leaves more room on the carrier board for application-specific circuitry.
A multi-device interface plus LCC/LGA contacts supports flexible carrier-board routing for a range of peripherals.
| Processor | ST STM32MP25X |
|---|---|
| Core Architecture | Cortex-A35 + Cortex-M33 (MPU+MCU+NPU heterogeneous multi-core) |
| Memory (DDR4) | 1GB |
| Storage (eMMC) | 8GB |
| Operating System | Linux 6.1 |
| Operating Temperature | -40°C to +85°C |
| Dimensions | 37mm × 39mm × 2.8mm |
| Interface | Multi-device interface |
| Contact Type | LCC / LGA metal contacts |
| Module Type | Embedded minimum system (SOM) |
The IC610 module family offers a choice of DDR4 and eMMC capacities, so buyers can align on-board resources with the target workload. This page covers the standard configuration; the extended configuration is listed for reference.
The IC610 is assembled on a PCB substrate populated with SMD electronic components, including the ST STM32MP25X processor, ICs and passive components. Connection to the customer carrier board is made through LCC/LGA metal contacts, and the assembly is finished with RoHS-compliant encapsulation materials. This construction keeps the module compact while protecting sensitive circuitry during handling and reflow soldering onto the application board.
Lierda provides embedded software customization, ODM and OEM services alongside its module products. Because the IC610 runs Linux 6.1 on a heterogeneous Cortex-A35 + Cortex-M33 architecture with a multi-device interface, integration support can be scoped around a specific carrier-board design and application software. Contact the team to discuss configuration, software and platform requirements.
Send your IC610 configuration and application requirements to our international team.
Lierda Science & Technology Group Co., Ltd. — founded 2001, listed on the Beijing Stock Exchange (stock code 920249), with a 224-person R&D team and an 18,000m² factory.
ic610-som-1gb-ddr4-8gb-emmc-top-view.png — Alt: IC610 industrial core module SOM with LCC contacts, top view
ic610-embedded-minimum-system-dimensions.png — Alt: IC610 module outline showing 37mm by 39mm by 2.8mm dimensions