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The IC610 is an industrial core module (System on Module) delivered as an embedded minimum system based on the ST STM32MP25X processor. It integrates a Cortex-A35 application core and a Cortex-M33 real-time core in an MPU+MCU+NPU heterogeneous multi-core architecture, letting one module run Linux-class workloads and real-time tasks side by side. This 2GB DDR4 + 32GB eMMC configuration provides the larger working memory and storage option within the family, and it runs Linux 6.1 across a -40°C to +85°C range.
At only 37mm × 39mm × 2.8mm, the module uses LCC/LGA metal contacts and a multi-device interface, so industrial HMI, charging pile controllers, IoT gateways, portable medical equipment and intelligent control systems can be developed without designing a full processor board.
The ST STM32MP25X pairs a Cortex-A35 core for Linux applications with a Cortex-M33 core for real-time control in one MPU+MCU+NPU design.
The larger memory and storage option supports applications that multitask or hold more local data on the edge device.
Rated for -40°C to +85°C, supporting equipment deployed in uncontrolled industrial environments.
Runs the Linux 6.1 operating system, giving development teams a mature software stack and toolchain.
The small module format frees carrier-board area for application-specific circuitry even with the higher memory configuration.
A multi-device interface plus LCC/LGA contacts supports flexible carrier-board routing for a range of peripherals.
| Processor | ST STM32MP25X |
|---|---|
| Core Architecture | Cortex-A35 + Cortex-M33 (MPU+MCU+NPU heterogeneous multi-core) |
| Memory (DDR4) | 2GB |
| Storage (eMMC) | 32GB |
| Operating System | Linux 6.1 |
| Operating Temperature | -40°C to +85°C |
| Dimensions | 37mm × 39mm × 2.8mm |
| Interface | Multi-device interface |
| Contact Type | LCC / LGA metal contacts |
| Module Type | Embedded minimum system (SOM) |
The IC610 family offers selectable DDR4 and eMMC capacities. This page covers the extended configuration; the standard configuration is listed for reference.
The IC610 is assembled on a PCB substrate populated with SMD electronic components, including the ST STM32MP25X processor, ICs and passive components. Connection to the customer carrier board is made through LCC/LGA metal contacts, and the assembly is finished with RoHS-compliant encapsulation materials. This construction keeps the module compact while protecting sensitive circuitry during handling and reflow soldering onto the application board.
Lierda provides embedded software customization, ODM and OEM services alongside its module products. Because the IC610 runs Linux 6.1 on a heterogeneous Cortex-A35 + Cortex-M33 architecture with a multi-device interface and 2GB DDR4 + 32GB eMMC on board, integration support can be scoped around a specific carrier-board design and application software. Contact the team to discuss configuration, software and platform requirements.
Send your IC610 configuration and application requirements to our international team.
Lierda Science & Technology Group Co., Ltd. — founded 2001, listed on the Beijing Stock Exchange (stock code 920249), with a 224-person R&D team and an 18,000m² factory.
ic610-som-2gb-ddr4-32gb-emmc-top-view.png — Alt: IC610 industrial core module SOM with LCC contacts, top view
ic610-embedded-minimum-system-dimensions.png — Alt: IC610 module outline showing 37mm by 39mm by 2.8mm dimensions